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JR0149641 - CMP/WETs/Electroplating Technology Development Equipment Engineer|
At Intel, we optimize storage and memory from device physics to platform architecture to system level solutions while collaborating with industry leaders to help our customers. We continue to invest in Intel Optane technology that delivers industry-leading low latency (it's super-fast!). F11x in Rio Rancho, New Mexico is Intel's new Non-Volatile Memory Solutions Group (NSG) Technology Development site and will focus on 3DxP Technology Development and Pathfinding.
To deliver the silicon technology, the Intel NSG Rio Rancho Technology Development (RTD) group is looking for an experienced CMP, WETS AND PLATING Technology Development Equipment Engineer to help enable the 3DxP and NAND technology development. As an NSG RTD CMP, WETS AND PLATING TD Equipment Engineer, you would be responsible for multiple tool sets within CMP, WETS AND PLATING.
Your responsibilities would include:
o Defining and executing new tool installations and qualifications.
o Working closely with tool vendors to resolve equipment issues.
o Working closely with facilities and subfab engineering for design, configuration, and issue resolution for subafab components (gas/chem delivery, precursor cabinets, abatement units, pumps, etc.) .
o Working closely with EHS to develop and maintain safe equipment configurations and maintenance procedures.
o Developing and owning hardware specs for CMP, WETS AND PLATING equipment.
o Defining CMP, WETS AND PLATING equipment road maps to meet requirements, goals and milestones for new technology processes.
o Working with technology development engineers to develop, prioritize, and manage projects.
o Working closely with the operations team and vendors to meet target tool availability.
o Identifying, quantifying, and qualifying cost reduction projects.
Additional responsibilities include, but are not limited to:
o Providing hands on equipment training to engineers and equipment maintenance technicians.
The ideal candidate should exhibit the following behavioral traits:
o Flexible in accommodating changing priorities and working hours to support business needs
o Partnering and teamwork skills
o Communication and stakeholder management skills.
o Proven experience in multi-tasking complex projects.
Inside this Business Group
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
o AS/ BS /MS /Ph.D degree in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Material Science, Physics, or Chemistry with 5+ years of experience in the semiconductor industry.
o Minimum 5+ years of experience in an Equipment Engineering role (CMP, WETS AND PLATING) supporting equipment tool install/qual, development, troubleshooting, procedure documentation and maintenance.
o Minimum 10+ years of experience in an Equipment Engineering role (CMP, WETS AND PLATING) supporting equipment tool install/qual, development, troubleshooting, procedure documentation and maintenance.
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.